141 revised: january 11, 2011 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. silicon protection array (spa ? ) products sp6001 series sp6001 12pf emi filter array with esd protection description applications the littelfuse sp6001 spa series integrates 4, 6 and 8 emi ?lters (c-r-c) into a small, low-pro?le udfn package with each ?lter providing greater than -30db attenuation at 1ghz. additionally, each i/o is capable of shunting 30kv esd strikes (iec61000-4-2, contact discharge) away from sensitive electronic components. the performance of this small, slim design makes it extremely suitable for mobile handsets, pdas and notebook computers. features ? emi ?ltering of frequencies from 800mhz to 3ghz ? greater than -30db attenuation (typ) at 1ghz ? esd, iec61000-4-2, 30kv contact, 30kv air ? small, low-pro?le udfn package (typ 0.5mm height) ? keypad interface for portable electronics ? lcd and camera display interfaces for handsets ? connector interfaces for portable electronics ? mobile phone ? smartphone ? portable navigation device pinout 5 8 1 4 1 6 7 12 gnd 18 9 16 gnd gnd sp6001-04utg-1 sp6001-06utg-1 udfn-08 udfn-12 sp6001-08utg-1 udfn-16 functional block diagram cd cd 18 cd cd 27 cd cd 36 cd cd 4 5 cd cd 1 12 cd cd 2 11 cd cd 3 10 cd cd 4 9 cd cd 5 8 cd cd 67 sp6001-04utg-1 sp6001-06utg-1 sp6001 series rohs pb green application examples baseband d1 pcb connector for lcd display d2 ic d3 d 4 d1 camera module d2 ic d3 d 4 baseband d 5 d6 d7 d8 sp6001-0 4 utg-1 sp6001-08utg-1
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 142 revised: january 11, 2011 silicon protection array (spa ? ) products sp6001 series 12pf emi filter array with esd protection caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. absolute maximum ratings symbol parameter value units t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm 6.0 v breakdown voltage v br i r =1ma 7. 0 (-10% of typ) 7. 8 8.5 (+10%of typ) v reverse leakage current i leak v rwm =5v 0.1 1.0 a resistance r a i r =10ma 85 (-15% of typ) 100 115 (+15% of typ) diode capacitance 1,2 c d v r =2.5v,f=1mhz 12 pf line capacitance 1,2 c l v r =2.5v,f=1mhz 19 (-20%of typ) 24 29 (+20%of typ) pf esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv cutoff frequency 3 f -3db above this frequency, appreciable attenutation occurs 115 mhz notes: 1 parameter is guaranteed by design and/or device characterization. 2 total line capacitance is two times the diode capacitance (c d ). 3 50 source and 50 load termination analog crosstalk (s41) insertion loss (s21) 3.000 000mhz stop 6 000.000.000mhz x2 start 21 log mag 5 db/ ref 0 db 1 _:- 5 .8807 db ch1 s cor smo 1 start 3.000 000 mhz stop 6 000.000 000 mhz x2 ch1 s log mag 10 db/ ref 0 db smo cor del 1 product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13.
143 revised: january 11, 2011 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. silicon protection array (spa ? ) products sp6001 series sp6001 12pf emi filter array with esd protection line capacitance vs. dc bias 0 10 20 30 40 5 0 dc bias (v) capacitance (pf) 0.0 0. 5 1.0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 5 5 .0 time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zone t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters package dimensions udfn-16 udfn-16 millimeters inches min max min max a 0.45 0.55 0.01 0.02 a1 0.00 0.05 0.00 0.002 a3 0.127 ref 0.00 ref b 0.15 0.25 0.00 0.00 d 3.20 3.40 0.12 0.13 d2 2.70 2.90 0.10 0.11 e 1.25 1.45 0.04 0.05 e2 0.30 0.50 0.01 0.01 e 0.40 bsc 0.01 bsc k 0.20 0.00 l 0.15 0.35 0.00 0.01 d e a3 d2 a a1 e2 l b e k package dimensions udfn-08 udfn-08 millimeters inches min max min max a 0.450 0.550 0.018 0.022 a1 0.000 0.050 0.000 0.002 a3 0.127 ref 0.005 ref b 0.150 0.250 0.006 0.010 d 1.600 1.800 0.063 0.071 d2 1.100 1.300 0.043 0.051 e 1.250 1.450 0.049 0.057 e2 0.300 0.500 0.012 0.020 e 0.400 bsc 0.016 bsc k 0.200 0.008 0.000 l 0.150 0.350 0.006 0.014 d e a a1 a3 d2 e2 l k b e package dimensions udfn-12 udfn-12 millimeters inches min max min max a 0.450 0.550 0.018 0.022 a1 0.000 0.050 0.000 0.002 a3 0.127 ref 0.005 ref b 0.150 0.250 0.006 0.010 d 2.400 2.600 0.094 0.102 d2 1.900 2.100 0.075 0.083 e 1.250 1.450 0.049 0.057 e2 0.300 0.500 0.012 0.020 e 0.400 bsc 0.016 bsc k 0.200 0.008 0.000 l 0.150 0.350 0.006 0.014 d e a a1 a3 d2 e2 l k b e
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 144 revised: january 11, 2011 silicon protection array (spa ? ) products sp6001 series 12pf emi filter array with esd protection embossed carrier tape & reel speci?cation C udfn-08 p2 d e f t w bo ko ao p d1 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 1.00 - 0.040 - d 1.50 min 0.059 min p 3.90 4.10 0.154 0.161 10p 40.0 +/- 0.20 1.575 +/- 0.008 w 7.70 8.30 0.303 0.327 p2 1.95 2.05 0.077 0.081 a0 1.55 1.75 0.061 0.069 b0 1.90 2.1 0.075 0.083 k0 0.95 1.15 0.037 0.045 t 0.30 max 0.012 max embossed carrier tape & reel speci?cation C udfn-12 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 0.55 0.65 0.021 0.025 d 1.50 min 0.059 min p 3.90 4.10 0.154 0.161 10p 40.0 +/- 0.20 1.575 +/- 0.008 w 7.90 8.30 0.311 0.327 p2 1.95 2.05 0.077 0.081 a0 1.33 1.53 0.052 0.060 b0 2.63 2.83 0.103 0.111 k0 0.58 0.78 0.023 0.031 t 0.22 max 0.009 max p2 t bo e f w od / od / p k0 a0 embossed carrier tape & reel speci?cation C udfn-16 ++ + ++ ++ + + + a0 k0 b0 p0 p2 p1 d0 ? e f w t 1.00 0.0 5 12o max 12o max millimetres inches min max min max a0 1.55 1.75 0.06 0.06 b0 3.50 3.70 0.13 0.14 d0 1.40 1.60 0.05 0.06 e 1.65 1.85 0.06 0.07 f 5.45 5.55 0.21 0.21 k0 0.85 1.05 0.03 0.04 p0 3.90 4.10 0.15 0.16 p1 1.95 2.05 0.07 0.08 p2 3.90 4.10 0.15 0.16 t 0.26 0.30 0.01 0.01 w 11.90 12.30 0.46 0.48 ordering information part number package size (mm) marking min. order qty. sp6001-04utg-1 udfn-08 1.7x1.35 jh4 3000 sp6001-06utg-1 udfn-12 2.5x1.35 jh6 3000 sp6001-08utg-1 udfn-16 3.3x1.35 jh8 3000 part numbering system part marking system sp 6001 0x u t g -1 silicon protection array series package udfn-08 (1.7x1.3 5 mm) udfn-12 (2. 5 x1.3 5 mm) udfn-16 (3.3x1.3 5 mm) t= tape & reel g= green number of channels 04 = 4 channel udfn-08 06 = 6 channel udfn-12 08 = 8 channel udfn-16 C jh4 jh6 jh8 j h x product series j = sp6001 assembly site 4 = udfn-08 6 = udfn-12 8 = udfn-16
|
